Testing

ENSIL Canada Ltd. can offer a full range of testing services covering in-circuit test (ATE), functional and full system testing of your products.
ENSIL Canada Ltd. places a high priority on testing and measurement to ensure that your contract requirements are met and that your product reliability is maintained. Developing your test strategy with you is part of our service and your project inspection and test records can also be provided as part of our support for each of your customers.

Inspection

In a world where array packages are increasingly contributing to a higher density requirements of circuit boards, ENSIL Canada Ltd. has invested in new inspection systems that enable it to check the integrity of terminations hidden beneath area array component packages, such as ball grid arrays (BGAs) and chip scale packages (CSPs), as well as those beneath flip-chip bare dice.
Our labs are equipped with inspection systems that can perform sophisticated correlations and movements in real-time in order to provide revealing views of hidden solder joints on surface-mount printed-circuit boards or internal views of the new generations of chip packages such as CSP and BGA. These systems allow us to orbit around an area of interest under the direction of simple hand movements. The motion controller translates these to three sets of synchronized motion that site the PCB or chip area of interest in the right position, while keeping it close against the X-ray source on one side and moving the imaging system as needed on the other. This level of flexibility and precision gives us the capability to handle most inspection requests encompassing through-hole, SMT and BGA technologies.